Laser cutting of alumina substrates

Basic data necessary for order processing to alumina substrate cutting

In HC electronics there is a CO2 laser used for cutting of alumina ceramics. It is especially used by the department of development and production of hybrid integrated circuits, however, it also ensures cutting or scribing of ceramics based on customers' requirements.

• ceramics may be supplied by the customer or we will secure the same ourselves
• maximum dimensions of substrate for cutting of ceramics: 100 x 100 mm
• maximum dimensions of substrate for scribing (pre-cutting) of ceramics: 100 x 160 mm
• maximum thickness of ceramics for cutting: 1 mm

This following data to order processing to alumina substrate laser cutting are necessary to know for us:

• substrate material
• dimensions of non-cut substrate
• thickness of substrate
• layout for cutting and grooving with tolerance quoting
• number of boards for cutting